Basic Surface Mount Technologies ( SMT ) (1 Day)

The Basic Knowledge of Surface Mount Technologies apply in PCBA ( Panel Circuit Board Assembly )

Target audience
1. Section Heads and Department Managers
2. Supervisor
3. Engineer

Course Objective
1. Enhance Quality of Solder Deposition
2. Improve Reflow Process Yield
3. Understand Solder Joint Metallurgy
4. Knowledge of Latest Developments
5. Advanced packages and attachment processes

Course Content
I. Industry Direction, Driving Factors and Process Overview

II. Solder Paste Characterization, Qualification and control

III. Solder Paste Deposition, Pad Layout Design and Printer Control

IV. Reflow Soldering and Perfecting Thermal Profiling

V. Component Placement Systems

VI. Solder Joint Quality and Reliability

VII. New Developments and Lead Free Soldering

VIII. SMT Rework Processes